Simcenter T3ster is the industry-standard thermal-transient-testing instrument for power semiconductor devices and LEDs. It measures junction-to-case and junction-to-ambient thermal resistance non-destructively, generates thermal structure functions that map the heat-flow path inside a package, and detects failures and degradation.
Capabilities
- JEDEC-standard JESD51-1, JESD51-14 thermal-resistance measurement.
- Thermal structure functions revealing internal package construction.
- Die-attach quality assessment.
- Reliability testing — degradation tracking under thermal cycling.
- Multi-channel for production-line in-line testing.
Where T3ster pays off
- Semiconductor manufacturers characterising package thermal performance.
- LED makers validating thermal claims for product datasheets.
- Reliability labs running long-term thermal-cycling studies.
- Quality engineering catching die-attach defects before products ship.